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PEEK (Polyether Ether Ketone)

PEEK (Polyether Ether Ketone)

Published by Ehsan Shamloo on Mar 21st 2025

PEEK (Polyether Ether Ketone) is a high-performance engineering plastic with exceptional mechanical properties, dimensional stability, chemical resistance, and thermal properties. While certain wet chemistries enable the surface functionalization of PEEK¹, its inertness and mechanical strength make it an ideal material for tubing and connectors used in bio and microfluidic applications. PEEK has a relatively high surface energy compared to fluoropolymers like PTFE or FEP, making it non-ideal for applications like transferring nanoparticles.

polyetherketon-peek-.pngFigure 1.  PEEK chemical structure                   

PEEK is generally considered incompatible with the following chemicals.

Incompatible Chemicals:

  • Methylene Chloride
  • THF
  • DMSO
  • Nitric Acid
  • Sulfuric Acid
  • Hydrofluoric Acid
  • Hydrobromic Acid
  • Hydroiodic Acid
  • Halogenated gases

PEEK has low permeability, preventing gases and liquids from passing through its structure. This characteristic makes it well-suited for applications that demand high chemical and temperature resistance, as well as long-term durability. Additionally, PEEK offers high dimensional stability under high pressure and temperature, making it suitable for use in high-pressure systems such as HPLC units.

PEEK polymer is produced by different manufacturers in crystalline and amorphous grades and parts are manufactured using virgin (unfilled) or filled polymer. The following table provides PEEK properties across all different brands. For exact values, refer to the specific brand's datasheet. Common PEEK brand names include:

  • Ketron®
  • SustaPEEK
  • TECAPEEK®
  • PEEK-LSG
  • Semitron® ESd 480
  • Susta® PEEK
  • Unitrex
  • Victrex® PEEK
  • Vestakeep PEEK

Note: "-" is used to show the range of properties across different manufacturers, and "/" is used to show the values under different conditions.

Physical Property Condition ASTM Unit Value
Relative Density - D792 - 1.26 - 1.32
Mold Shrinkage - D955 % 1.0 - 1.8
Water Absorption 24 hrs at 23 °C D570 % 0.1 - 0.5
pH Range - - - 0 - 14
Thread Strength - - - Excellent
Melt Flow Index 400 °C/2.16 kg D1238 g/10 min 4
Permeability (Water) 25 °C - ×10 -13 cm³·cm/cm².s·Pa 160 - 300
Permeability (Oxygen) 25 °C - ×10 -13 cm³·cm/cm².s·Pa 0.06 - 0.1
Friction Coefficient Dynamic D3702 - 0.23 - 0.45
Surface Energy (Treated) - D2578 ×10 -3 N/m 34 - 38 (60)
Mechanical Property Condition ASTM Unit Value
Tensile Strength (Yield) 23 / 250 °C D638 MPa 90 / 12
Tensile Strength (Break) - D638 MPa 90 - 150
Young's Modulus - D638 GPa 3.6 - 3.9
Elongation (Yield) - D638 % 4.9 - 5
Elongation (Break) - D638 % 30 - 150
Flextural Modulus 23 / 120 / 250 °C D790 GPa 4.1 / 4.0 / 0.3
Flextural Strength 23 / 120 / 250 °C D790 MPa 170 / 100 / 12.4
Izod Strength 23 °C D256 J/m 80 - 94
Hardness (Shore D) - D2240 - 85 - 95
Electrical Property Condition ASTM Unit Value
Arc Resistance - D495 s 40
Dielectric Constant 1 MHz D257 - 3.2 - 3.3
Dielectric Strength 50 um / 2 mm Thick D149 KV/mm 19 / 20
Dissipation Factor 1 MHz D150 ×10 -4 30
Volume Resistivity - D257 ×10 15 omh.cm 16 - 17
Surface Resistivity - D257 ×10 15 ohm 10
Thermal Property Condition ASTM Unit Value
Melting Point - D3418 °C 340
Glass Transition Temp. (T g) - DSC °C 140 - 145
Ductile Transition Temp. - - °C -65 - -60
Coeff. of Linear Thermal Exp. Tg D696 ×10 -5 /°C 4.7 / 10.8
Thermal Conductivity 23 °C E1530 W/m.K 0.25
Heat Deflection Temp. 1.8 MPa D648 °C 150 - 160
Max. Cont. Service Temp. - - °C 154 - 260
Min. Cont. Service Temp. - - °C -65 - -70
UL Cont. Service Temp. Mech. / Electr.   °C 240 / 260
Fire Resistance LOI   % 24 - 35
Flammability Rating - UL94 - V0
Sterilization Condition ASTM Unit Value
UV Light Resistance - - - Good
Autoclavable - - - Yes
Steam Sterilization 200 Cycles  - - No Effect
Heat Sterilization up to 260 °C - - No Effect
Chemical Sterilization Ethylene Oxide - - No Effect
Gamma Sterilization 1000 Mrads - - No Effect

  

References:

1. Zimmerer, Cordelia, et al. "Surface functionalization of poly (ether ether ketone) by wet-chemical modification with carboxylic acids and diamine." Journal of Adhesion Science and Technology 38.1 (2024): 139-162.