K-PRO Advanced Packaging Positive Photoresist (Film Thickness: 0.9µm - 25µm+)

K-PRO™ Advanced Packaging Positive Photoresist is purpose-built for thick-film patterning in packaging and electroplating workflows. Supporting 5–25 µm in a single coat and up to 50 µm via double-coat, K-PRO provides high sensitivity, high throughput, and excellent process latitude on i-line, g-line, and broadband exposure systems. The resist is compatible with plating of copper, pure tin, and nickel and integrates with metal-ion-free or metal-ion-bearing developers to match fab preferences. With no post-exposure bake required, K-PRO streamlines cycle time while maintaining robust feature fidelity across varied wafer topographies in advanced wafer-level packaging, TSVs, bumping, MEMS, and 3D photolithography.

Key features

• Tone: Positive
• Exposure bands: i-line, g-line, broadband
• Film thickness: 5 - 25 µm
• Developers: TMAH-based or KOH-based
• PEB: Not required
• Plating compatibility: Copper, pure tin, nickel
• Remover compatibility: NMP or DMSO 
• Drop-in Replacement for: AZ P4000 series

Applications
Advanced packaging, TSV, bumping, electroplating molds (Cu pillar, Ni, Sn), and MEMS/3D structures.

K-PRO Datasheet