Description
KL IR image-reversal photoresists run in positive or negative tone on i-line, g-line, and broadband tools. In negative mode they deliver excellent thermal stability and are optimized for metallization and lift-off. Develop with 0.26 N TMAH; remove with KL Photoresist Remover or standard NMP removers for straightforward integration.
Key features
- Tone: Image reversal capable — positive and negative modes
- Exposure bands: i-line, g-line, broadband
- Film thickness: 1.2 - 2.5 µm
- Profile control: Robust vertical sidewalls in negative mode; tunable undercut for clean lift-off
- Thermal stability (negative mode): Engineered for high-temperature metallization steps without profile collapse
- Developer: 0.26 N TMAH (industry-standard metal-ion-free); KOH compatibility per line practice
- Remover compatibility: KL Photoresist Remover or common NMP-based removers
- Applications: Metallization, lift-off, electroplating molds, TSV, etch masks, advanced packaging
