Description
KL IR image-reversal photoresists run in positive or negative tone on i-line, g-line, and broadband tools. In negative mode they deliver excellent thermal stability and are optimized for metallization and lift-off. Develop with 0.26 N TMAH; remove with KL Photoresist Remover or standard NMP removers for straightforward integration.
Pricing valid for US, Mexico, and Canada only. Import duties applicable for shipments outside of the US.
Key features
- Tone: Image reversal capable — positive and negative modes
- Exposure bands: i-line, g-line, broadband
- Film thickness: 1.2 - 2.5 µm
- Profile control: Robust vertical sidewalls in negative mode; tunable undercut for clean lift-off
- Thermal stability (negative mode): Engineered for high-temperature metallization steps without profile collapse
- Developer: 0.26 N TMAH (industry-standard metal-ion-free); KOH compatibility per line practice
- Remover compatibility: KL Photoresist Remover or common NMP-based removers
- Applications: Metallization, lift-off, electroplating molds, TSV, etch masks, advanced packaging
Pricing valid for USA, Mexico, and Canada.
