Description
Sublym™ is a portable hot embossing system used to pattern microfluidic features onto many different thermoplastics. Sublym™ can also be used for thermal bonding of Flexdym™ to materials like PMMA or COC. Sublym™ is compatible with a variety of master molds including, but not limited to epoxy molds, etched glass, CNC'd metal, and silicon wafers. Max size is 100 mm diameter or 4" wafer.
Each Sublym™ kit includes the Counter Mold, Heat Resistance Gloves, Spacers/Washers, and Replacement Membranes. Some items needed but not included scissors, tweezers, isopropanol, and mold/thermoplastic.
Check out this video below on how Sublym is used to hot emboss PMMA, COC, and PS!
