Description
KL6000 Thick-Film i/g-Line Positive Photoresist is designed for advanced packaging, TSV, bumping, and electroplating applications that demand reliable thick-film builds. The KL6000 series supports 2.5–12 µm single-coat films with high sensitivity, high throughput, and excellent process latitude. Optimized for 0.26 N TMAH developers and requiring no post-exposure bake, KL6000 streamlines cycle time while maintaining consistent feature fidelity. As a practical, drop-in alternative to thick-film standards such as SPR™ 220-3.0, 220-4.5, 220-7.0, and S1827™, KL6000 provides a clean upgrade path for packaging lines seeking productivity without sacrificing performance.
Key features
- Tone: Positive
- Exposure bands: i-line, g-Line, broadband
- Film thickness: 2.5 - 12 µm+
- Developer: 0.26 N TMAH
- PEB: Not required
- Process: High sensitivity, high throughput, wide latitude
- Drop-in Replacement for: SPR™ 220-3.0, SPR™ 220-4.5, SPR™ 220-7.0, S1827™
Applications
Advanced packaging, TSV patterning, wafer bumping, and electroplating molds (e.g., copper pillar, UBM, RDL features).
| Current Resist | KemLab Replacement | Approx. KemLab FT (microns) Range |
| S1818 | KL6002 | 1.5 – 3.0 |
| S1821 | ||
| SPR220-3.0 | KL6003 | 2.5 – 4.5 |
| S1827 | ||
| SPR220-4.5 | KL6005 | 4.0 – 7.0 |
| SPR220-7.0 | KL6008 | 5.0 – 12.0+ |
