KL5300 General Purpose Positive Photoresist (Film Thickness: 0.15µm - 2.5µm)

KL5300 Broadband i/g-Line Positive Photoresist delivers high sensitivity and sub-micron resolution for i-Line, g-Line, and broadband lithography in IC fabrication. Optimized for 0.26 N TMAH developers, KL5300 provides excellent process latitude and uniform films from 0.15 to 2.5 µm in a single coat (typical operation 0.5–2.0 µm). With resolution down to 0.55 µm, it’s a practical, drop-in option versus S1805, S1808, S1811, S1813, and S1818 while maintaining consistent throughput and yield.

Pricing valid for US, Mexico, and Canada only. Import duties applicable for shipments outside of the US.

Key features:

• Exposure: i-line, g-line, broadband
• Tone: Positive
• Resolution: up to 0.55 µm
• Film thickness: 0.15 - 2.5 µm
• Developer: 0.26 N TMAH
• Process latitude: high sensitivity, excellent uniformity
• Use cases: IC fabrication, MEMS, rapid prototyping
• Drop-in Replacement for: S1805, S1808, S1811, S1813, S1818

Applications:
IC front-end & back-end patterning, thin-film processes needing sub-micron features with robust process window.

KL5300 Datasheet

Please email info@elexansci.com for MSDS requests.