KL5300 General Purpose Positive Photoresist (Film Thickness: 0.15µm - 2.5µm)

KL5300 Broadband i/g-Line Positive Photoresist delivers high sensitivity and sub-micron resolution for i-Line, g-Line, and broadband lithography in IC fabrication. Optimized for 0.26 N TMAH developers, KL5300 provides excellent process latitude and uniform films from 0.15 to 2.5 µm in a single coat (typical operation 0.5–2.0 µm). With resolution down to 0.55 µm, it’s a practical, drop-in option versus S1805™, S1808™, S1811™, S1813™, and S1818™ while maintaining consistent throughput and yield.

Key features:

• Exposure: i-line, g-line, broadband
• Tone: Positive
• Resolution: up to 0.55 µm
• Film thickness: 0.15 - 2.5 µm
• Developer: 0.26 N TMAH
• Process latitude: high sensitivity, excellent uniformity
• Use cases: IC fabrication, MEMS, rapid prototyping
• Drop-in Replacement for: S1805™, S1808™, S1811™, S1813™, S1818™

Applications:
IC front-end & back-end patterning, thin-film processes needing sub-micron features with robust process window.

KL5300 Datasheet